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CSP Flip Chip;multichip modules with passives [Copy link] 中文

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Post time 2006-5-17 15:47:19 |Display all floors
Managed the factory Technical Development Department for System in Package (SiP) modules.  Package types included multichip modules with passives, CSP Flip Chip, Memory modules, finger print sensors, and mini HDD.
这段文字里面的技术词汇我不懂,请指教
1)multichip modules with passives,
2)CSP Flip Chip
3)mini HDD


谢谢!

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