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CSP Flip Chip;multichip modules with passives [Copy link] 中文

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Post time 2006-5-17 15:47:19 |Display all floors
Managed the factory Technical Development Department for System in Package (SiP) modules.  Package types included multichip modules with passives, CSP Flip Chip, Memory modules, finger print sensors, and mini HDD.
1)multichip modules with passives,
2)CSP Flip Chip
3)mini HDD


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