To address biggest weakness, Huawei must advance its chip manufacturingThis post was edited by tenderloin at 2019-3-21 15:41
In the semiconductor sector, China is very strong in application and also in design but the biggest weakness is chip manufacturing including equipment and process technology.Huawei is number 1 technology company by size and revenue in China.Huawei has Hisilicon designed all kind chips but it doesn't do any manufacturing.Some people said what about Qualcomm?No, Huawei cannot afford to be just fabless company like Qualcomm. it will have tough road ahead, being number 1 target by US. US will do whatever possible to bring it down. Huawei currently overly reliance on TSMC is ticking timebomb.Huawei needs to control its manufacturing like Samsung and Intel. No acutally Huawei needs to go even further than Samsung and Intel. It needs to source its equipment besides manufacturing. process.Huawei needs to take charge of its own destiny from all aspects and leave not a single vulnerable area exposed.1)Huawei needs to purchase 28nm and 14nm and future process IP from SMIC and start its own fab customized for its own product. SMIC currently cannot handle the volume from many customers and will affect Huawei.2)Huawei needs to acquire SMEE and use its vast resources to speed up the development of lithography equipment from currently 90nm to something smaller in geometry. SMEE currently got stuck at 90 nm mainly due to lack of resources;funding and talents. Huawei have resources to hep SMEE to breakthrough. 3)Currently Huawei relying on TSMC for the 7nm product but once its starts the various projects concurrentlyeventually it weans itself from TSMCHuawei cannot afford to be a pure fabless company because its now the biggest political target by US. Its relying on others for manufacturing could easily be disrupted. huawei planning to acquire SMEE to enter Lithograph equipment.
advance from current 90nm equipment to 10nm.